Semiconductor device

ABSTRACT

The read speed of an on-chip nonvolatile memory enabling electric rewrite is increased. The nonvolatile memory has a hierarchal bit line structure having first bit lines specific to each of a plurality of memory arrays, a second bit line shared between the plurality of memory arrays, a first selector circuit selecting the first bit line for each of the memory arrays to connect the selected first bit line to the second bit line, and a sense amp arranged between the output of the first selector circuit and the second bit line. The hierarchal bit line structure having the divided memory arrays can reduce the input load capacity of the sense amp.

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims priority from Japanese patent applicationJP 2003-108604 filed on Apr. 14, 2003, the content of which is herebyincorporated by reference into this application.

BACKGROUND OF THE INVENTION

The present invention relates to a nonvolatile memory enabling electricerase and write and to a semiconductor integrated circuit such as a dataprocessor called a microcomputer or a microprocessor equipped with thenonvolatile memory together with a central processing unit (also calleda CPU), e.g., to a technique effective to be applied to a microcomputerequipped with a flash memory.

In the read operation of a flash memory, 1) a read bit line isprecharged, 2) a word line is started up at a selective level such as ahigh level (“H”) to turn on a memory cell transistor, 3) upon flowing ofa memory current via the memory cell transistor, the precharged bit lineis drawn out to a low level (“L”), and 4) the potential of the bit linedrawn out to the low level is sensed by a sense amp.

When a threshold voltage (Vth) of a memory cell transistor is lower thana word line potential (word line selected level), a bit line isdischarged to read data “1”. When the Vth of the memory is higher thanthe word line potential, the bit line is not discharged to read data“0”. At fast read, the bit line capacity must be smaller to bedischarged at high speed. Typically, a bit line hierarchical structureis employed. In the bit line load capacity, the drain capacity of thememory is dominant. In the bit line hierarchical structure, a bit lineis divided into some blocks to provide a multiple sub-bit linestructure. A memory is connected to the divided sub-bit lines. Thesub-bit lines are connected via a hierarchical switch to a main bitline. When the bit line hierarchical structure is employed, the bit lineload capacity is the total of a sub-bit line load obtained by summingthe wiring capacity of sub-bit lines connected to a limited number ofmemories and the drain capacity of the memories connected and a main bitline load which is mainly a wiring capacity. This is a load capacity ofa fraction of the case that all memories are connected to a main bitline without having a hierarchical structure. A memory currentdischarges these small loads fast to amplify the lowered bit linepotential by a sense amp. When performing write, a hierarchical switchincluding a write word line is turned on to give a write pulse to a mainbit line. As a result, the pulse passes through the hierarchical switchto be given to a sub-bit line. It is not applied to other sub-bit lines.As compared with the case that all memories are connected to a main bitline, time to add drain disturb can be significantly reduced.

As another fast read method, there is a structure having a plurality ofdivided memory arrays each having a read circuit and a write circuit(see Patent Document 1). For example, each of four divided memory arrayshas a row decoder and a sense amp whose outputs are connected to a busline. When there is an access, the highest order address is decided tooperate any one of the arrays. Similarly, at write, the highest orderaddress is decided to transfer write data from the bus line to any oneof the write circuits.

[Patent Document 1]

Japanese Unexamined Patent Publication No. 2000-339983

SUMMARY OF THE INVENTION

The above hierarchal bit line structure only with main and sub-bit linescannot solve signal propagation delay due to the main bit line loadcapacity and cannot cope with the desire to increase the read speed.

In a plurality of divided arrays represented by Patent Document 1, thebit line is completely disconnected between the arrays. This ispreferable for increasing the speed. Each of the arrays must be providedwith a read circuit, a write circuit and an interface circuit with thebus line corresponding to the number of the divided arrays, resulting inincreased size of the circuit. The same main bit line is used at writeand read. When applying a high voltage to the bit line at erase andwrite, a high voltage read data circuit must be considered.

The sense amp part is arranged at the bit line end of the memory array.The number of sense amps must be above the number of bits read inparallel. These are operated in parallel and have a relatively largeelectric current consumption. For this reason, power noise easilyoccurs. The sense amp amplifies a very small voltage. Unnecessary noiseoccurrence results in malfunction. To lower the power source impedanceof a power source supplied to the sense amp, the wire width must belarge. However, this increases the chip occupation area.

A flash memory for storing a program incorporated in a microcomputermust be read at the same speed as a CPU. With microfabrication, theoperation speed of the CPU is increased. However, the flash memorycannot thin an oxide film of a charge accumulation part withmicrofabrication. Therefore, it is difficult to increase the memorycurrent. The operation speed of the microcomputer is decided by theaccess time of the incorporated flash memory. A faster read operation isparticularly important in the on-chip flash memory in the microcomputer.Thus, the present inventors have found that the flash memory readcircuit method must be further devised.

An object of the present invention is to provide a semiconductorintegrated circuit which can increase the read speed of an on-chipnonvolatile memory enabling electric rewrite.

Another object of the present invention is to provide a semiconductorintegrated circuit which can increase the read speed of an on-chipnonvolatile memory by minimizing the increased circuit size.

The above and other objects and novel features of the present inventionwill be apparent from the description of this specification and theaccompanying drawings.

The representative inventions disclosed in the present invention will bebriefly described as follows.

[1]<Read data circuit hierarchization> A semiconductor integratedcircuit according to the present invention has a nonvolatile memoryenabling electric erase and write over a semiconductor substrate. Thenonvolatile memory has a hierarchal bit line structure having first bitlines (BL) specific to each of a plurality of memory arrays, a secondbit line (GBLr) shared between the first bit lines of the plurality ofmemory arrays, and a sense amp (SA) arranged between the first andsecond bit lines. More specifically, the nonvolatile memory has ahierarchal bit line structure having first bit lines specific to each ofa plurality of memory arrays, a second bit line shared between theplurality of memory arrays, a first selector circuit (22) selecting thefirst bit line for each of the memory arrays to connect the selectedline to the second bit line, and a sense amp arranged between the outputof the first selector circuit and the second bit line. The hierarchicalbit line structure having divided memory arrays can reduce the inputload capacity of the sense amp. The divided memory arrays increase thenumber of bit line selector circuits and sense amps.

The sense amp is a differential sense amp arranged between a pair ofmemory arrays adjacent to each other, one of a pair of differentialinputs is a read signal from the first bit line selected by one of thememory arrays, and the other input is a reference input. Differentialsense contributes to a faster read operation.

The semiconductor integrated circuit may have a main amp (MA) whoseinput terminal is connected to the second bit line. With this, the readoperation can be much faster.

The main amp is a differential amp whose differential inputs areconnected to a pair of second bit lines adjacent to each other, one ofthe pair of differential inputs is a read signal outputted to one of thesecond bit lines, and the other input is a reference input. The main ampis differentiated, so that the read operation is much faster.

[2]<Write data circuit unification> In the above description, write ofstorage information is focused on. The semiconductor integrated circuithas a third bit line (GBLw) for write shared between the plurality ofmemory arrays aside from the second bit line. When employing the dividedmemory array structure, a write circuit and a write data circuit such asa write data latch need not be arranged for each of the memory arrays.The number of the third bit lines corresponds to the number of parallelwrite bits to the memory array. Parallel write can be made by a desirednumber of bits (e.g., 512 bytes) without being limited to the number ofread bits (e.g., 32 bits) of storage information from the memory array.

The semiconductor integrated circuit has a disconnect circuit (34, DSW)capable of connecting and disconnecting the corresponding first bit linefor each of the memory arrays to/from the third bit line. The disconnectcircuit of the memory array to be read in a read operation disconnectsthe third bit line from the first bit line. An undesired load of thethird bit line can be disconnected in the read operation, ensuring fastread. Since the memory array to be read is disconnected from the thirdbit line, the read operation of the second bit line and the writeoperation of the third bit line can be performed in parallel.

Verify read is performed using the third bit line. The semiconductorintegrated circuit has a second selector circuit (30) selecting thethird bit line by the number of external parallel input/output bits ofdata, and a verify amp (31) sensing verify read data from the third bitline selected by the second selector circuit. The verify amp need not bedistributed for each of the memory arrays.

[3]<Sense amp power source> The sense amps are distributed by the memoryarray hierarchization. First power source wires (61, 62) are providedfor every plural parallel sense amps along its parallel direction.Second power source wires (63, 64) wider than the first power sourcewires are provided in positions spaced from the first power sourcewires. The respective first and second power source wires are connectedin a plurality of positions by third power source wires (65, 66)provided in the first bit line direction.

In the hierarchal sense method of the memory array hierarchization, aplurality of read circuits such as sense amps are arranged in a memorymat. The sense amp is arranged to cross the first bit line. Similarly,the power source line crosses the first bit line. When a plurality ofsense amps are operated in parallel, current concentration occurs. Forthis reason, the power source wiring width must be larger to suppressnoise occurrence. When this is performed for each sense amp array, thechip occupation area of the nonvolatile memory is increased. The widthof the first power source wires for each sense amp array is notincreased, the wide second power source wires are provided in positionsspaced therefrom, and the first and second power source wires areconnected by a plurality of third power source lines along the extensiondirection of the first bit lines. Operation power sources are notsupplied to the sense amp array from one end side in the arraydirection. They are supplied thereto in parallel from a large number ofthird power source wires crossing the array direction. When a largenumber of sense amps are operated in parallel, potential change due tocurrent concentration is difficult to occur. It is possible to suppressthe increased chip occupation area due to the power source wires forsense amp.

As a specific form, one of the third bit lines shared between theplurality of memory arrays is provided for every two first bit lines.When the disconnect circuit can connect or disconnect one third bit lineto/from any one of the corresponding two first bit lines in each of thememory arrays, the third power source wire may be arranged every twofirst bit lines in therebetween. The increased chip occupation area dueto the third bit line can be minimized.

[4]<Parallel access> The above semiconductor integrated circuitseparately has the second bit line for read and the third bit line forwrite. The disconnect circuit of the memory array to be read in a readoperation disconnects the third bit line from the first bit line. A readoperation and erase and write operations can be performed in parallel todifferent memory arrays. In order to perform the erase and writeoperations in the same cycle, the semiconductor integrated circuitseparately has a first address decoder (70, CDEC) selecting theoperation of the word line, the first bit line, the disconnect circuitand the sense amp in a read operation, and a second address decoder (71)selecting the operation of the word line and the disconnect circuit in awrite operation.

As described above, a storage area storing a rewrite sequence program ofa nonvolatile memory and a storage area freely rewritable by the usercan be arranged in the same nonvolatile memory. The hierarchal bit linestructure realizing the hierarchal sense method is separated from thewrite bit line structure to perform write and read in parallel in thesame memory cycle. While reading and executing the rewrite sequenceprogram, the memory of the user area can be rewritten. The rewritesequence program need not be transferred to a RAM. The nonvolatilememory can be mounted over a semiconductor integrated circuit notincorporating such RAM.

[5]<Pipeline access> The first and second address decoders employaddress code logic performing address mapping so that the memory arrayssharing the sense amp are different to consecutive addresses. Whensequentially accessing the adjacent data in access units, differentmemory arrays are sequentially selected.

Assuming the address mapping, a first pipeline access form will bedescribed. This is realized in such a manner that in a read operation,the first address decoder responds to the change of an address signal tohold the address decode signal and a select signal of the first bit linefor each of the corresponding memory arrays by the number of cyclesnecessary for the read operation, and responds to the change of theaddress signal to operate the sense amp with delay. This can performdata read of the sequential addresses while changing the address signalfor each cycle.

A second pipeline access form may be employed. In a read operation, thefirst address decoder selects, in parallel, word lines and first bitlines of an address specified by an address signal and the next address,and sequentially drive controls the driving of the second bit line ofthe respective sense amps corresponding to the specified address and thenext address.

[6]<Data processor> The semiconductor integrated circuit has a centralprocessing unit capable of accessing the nonvolatile memory over thesemiconductor substrate. The control of erase and write processing tothe nonvolatile memory may be performed by the central processing unit.For example, the memory arrays of part of the plurality of memory arraysare a data area, the remaining memory arrays are a management area, andthe management area is a storage area of a rewrite sequence controlprogram for rewriting the data area. The central processing unit readsand executes the rewrite sequence control program from the managementarea and enables rewrite control of the data area.

[7]<Nonvolatile Memory Device>

A nonvolatile memory device according to the present invention has acontroller, and one or more nonvolatile memories. The nonvolatile memoryis divided into a plurality of memory arrays and has memory arraysbelonging to a first group and memory arrays of a second group havingmemory arrays corresponding to the respective memory arrays belonging tothe first group. The controller can control, in parallel, a first accessoperation to first memory arrays of a predetermined first group and asecond access operation to third memory arrays except for the firstmemory arrays and second memory arrays of the second group correspondingto the first memory arrays.

A plurality of sense amps (SA) are provided between the memory arraysbelonging to the first group and the corresponding memory arrays of thesecond group. Each of the memory arrays has a plurality of first bitlines (BL) and the first bit lines of the memory arrays of the firstgroup and the first bit lines of the corresponding memory arrays of thesecond group are connected to the input terminals of the sense amps. Theoutputs of the sense amps are connected to the second bit lines (GBLr).The first and second bit lines are used for a read operation and thethird bit line (GBLw) is used for a write operation.

The nonvolatile memory device according to the present invention canperform, in parallel, read and write operations by memory arraysdifferent from each other to shorten turnaround time seen from the user.

<Verify Read>

A semiconductor integrated circuit according to the present invention inanother view has a nonvolatile memory enabling electric erase and writeover a semiconductor substrate. The nonvolatile memory has a hierarchalbit line structure having first bit lines (BL) specific to each of aplurality of memory arrays, a second bit line (GBLr) shared between thefirst bit lines of the plurality of memory arrays, a third bit line(GBLv) shared between the plurality of memory arrays, and a sense amp(SA) selectively amplifying data read from the first bit line to outputthe amplified data to the second bit line in a first read operation andto output the data to the third bit line in a second read operation.

As a specific form of the present invention, the first read operation isa read operation for outputting read data to the outside of thesemiconductor integrated circuit. The second read operation is a verifyread operation for deciding, based on the read data in data write intothe memory array, whether a write operation or an erase operation ofdata is continued or not.

When performing the read operation and the verify read operation duringthe write operation in parallel in different hierarchies, the paths ofthe read data from both are individualized to solve read data conflictfrom both. Turnaround time seen from the user can be shortened.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of a microcomputer as an example of asemiconductor integrated circuit according to the present invention;

FIG. 2 is a block diagram showing an overall on-chip flash memory;

FIG. 3 is a schematic sectional view illustrating a nonvolatile memorycell of a stacked gate structure;

FIG. 4 is a circuit diagram illustrating a detail of a hierarchal bitline structure of a memory mat;

FIG. 5 is a circuit diagram illustrating a detail of a hierarchal bitline structure of the memory mat performing differential sense;

FIG. 6 is a circuit diagram showing an example of a sense amp fordifferential sense;

FIG. 7 is a timing chart of data read operations of a differential senseamp and a differential main amp;

FIG. 8 is a circuit diagram illustrating another detail of thehierarchal bit line structure of the memory mat performing differentialsense;

FIG. 9 is an explanatory view illustrating a power source wiring layoutof sense amp arrays;

FIG. 10 is an explanatory view showing a comparison example of the senseamp power source layout;

FIG. 11 is an explanatory view conceptually showing the structure of rowdecoders enabling a read operation and an erase or write operation inthe same cycle;

FIG. 12 is a timing chart illustrating operation timings of write andread processing to memory arrays different from each other;

FIG. 13 is an explanatory view showing an application example of theflash memory of FIG. 11;

FIG. 14 is an explanatory view of an operation using the flash memory ofFIG. 11;

FIG. 15 is a flowchart illustrating a rewrite control procedure usingthe flash memory of FIG. 11;

FIG. 16 is a schematic block diagram of the flash memory when realizinga first pipeline access form;

FIG. 17 is a logic circuit diagram of a decoder employed for the flashmemory when realizing the first pipeline access form;

FIG. 18 is a timing chart of a pipeline read operation of the firstpipeline access form;

FIG. 19 is a schematic block diagram of a flash memory when realizing asecond pipeline access form;

FIG. 20 is a logic circuit diagram of a decoder employed for the flashmemory when realizing the second pipeline access form;

FIG. 21 is a timing chart of a pipeline read operation of the secondpipeline access form;

FIG. 22 is a circuit diagram of the sense amp employed in place of FIG.6 when realizing the second pipeline access form;

FIG. 23 is a block diagram schematically showing a memory card as anexample of a nonvolatile memory device according to the presentinvention;

FIG. 24 is a block diagram schematically showing a memory card asanother example of the nonvolatile memory device according to thepresent invention;

FIG. 25 is a block diagram schematically showing the flash memory whenrealizing read data conflict prevention;

FIG. 26 is an operation timing chart of the flash memory shown in FIG.25;

FIG. 27 is a block diagram schematically showing another flash memorywhen realizing read data conflict prevention;

FIG. 28 is an operation timing chart of the flash memory shown in FIG.27; and

FIG. 29 is a circuit diagram illustrating a detail of the sense amp SAused in an embodiment shown in FIGS. 25 to 28.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

<Microcomputer>

FIG. 1 illustrates a single-chip microcomputer called a data processoror a microprocessor as an example of a semiconductor integrated circuitaccording to the present invention.

The microcomputer shown in the drawing is not particularly limited andis formed over one semiconductor substrate (chip) such as a singlecrystal silicon by a known semiconductor integrated circuit fabricationtechnique.

A microcomputer 1 has, as a circuit module connected to an internal bus2, a central processing unit (also indicated as a CPU) 3, a randomaccess memory (also indicated as a RAM) 4 used for a work area of theCPU 2, a bus controller 5, an oscillator 7, a frequency divider circuit8, a flash memory 9, a power circuit 10, an input/output port (I/O) 11,and other peripheral circuits 12 such as a timer counter. The CPU 3 hasa command control part and an execution part, decodes a fetched commandand performs operation processing by the execution part according to thedecode result. The flash memory 9 is not particularly limited and storesan operation program or data of the CPU 3. The power circuit 10generates high voltages for erase and write of the flash memory 9. Thefrequency divider circuit 8 frequency-divides source oscillation of theoscillator 7 to generate an operation reference clock signal and otherinternal clock signals. The internal bus 2 includes an address bus, adata bus and a control bus. The bus controller 5 responds to an accessrequest from the CPU 3 to perform bus access control of the number ofaccess cycles, the number of wait states and the bus width according toits accessed address.

In the state that the microcomputer 1 is mounted over the system, theCPU 3 performs erase and write control to the flash memory 9. In thedevice test or fabrication stage, an external write device, not shown,can directly perform erase and write control to the flash memory 9 viathe input/output port 11. After turning on, the inside of themicrocomputer 1 is initialized in the low level period of a resetsignal. When the high level of the reset signal releases reset, the CPU2 starts executing the program of the program area specified by thevector of address 0.

<Flash Memory>

FIG. 2 is a block diagram showing the overall flash memory 9. The flashmemory 9 has a memory mat 20 in which a large number of nonvolatilememory cells MC enabling electric erase and write are arrayed in amatrix. The nonvolatile memory cell MC is not particularly limited andis of a stacked gate structure having a source (source line connection),a drain (bit line connection), a channel, and a floating gate and acontrol gate (word line connection) stacked over the channel to beinsulation-formed mutually. Alternatively, it may be of a split gatestructure having a source (source line connection), a drain (bit lineconnection), a channel, and a selection gate (word line connection) anda memory gate (memory gate control line connection) adjacentlyinsulation-formed mutually over the channel.

The memory mat 20 is divided into a plurality of memory arrays 21. Aplurality of sub-bit lines BL are provided for each of the memory arrays21. The sub-bit line BL is selected by a column selector circuit 22. Theoutput of the column selector circuit 22 is received by a sense amparray 23. One sense amp SA is representatively shown for the sense amparray 23 in the drawing. The output of the sense amp array 23 isconnected to read main bit line GBLr shared between the memory arrays.That is, the bit line has a hierarchal bit line structure.

Amplification of the sense amp is performed by a hierarchal sensemethod. The sense amp array 23 is shared between a pair of memory arrays21 on the upper and lower sides in the drawing. The write data circuithas write bit line GBLw disconnected from the read data circuit. Thewrite bit line GBLw is not hierarchal to be shared between the memoryarrays 21. The sub-bit line BL corresponding to the write bit line GBLwcan be selectively connected or disconnected via a disconnect switchDSW. In a read operation, at least, the disconnect switch DSWdisconnects the write bit line GBLw from the sub-bit line BL in thememory array to be read. Not being particularly limited, the number ofread main bit lines GBLr is 32 and the number of write main bit linesGBLw is 1024.

Word line WL of the nonvolatile memory cell MC is selectively drivenaccording to the decode result of an address signal of a row decoder(RDEC) 25. The driving level is decided depending on erase, write orread processing to the flash memory. The selection of the sub-bit lineBL of the column selector circuit 22 is performed according to thedecode result of an address signal of a column decoder (CDEC) 26. Thedisconnect switch DSW and the sense amp SA are controlled by the rowdecoder 25 by the WRITE HIERARCHY SELECTION LINE and by the SPCs and theSENs according to the read, erase or write operation to the memoryarray. The address signal is supplied from address bus ABUS. The readmain bit line GBLr is connected via bus driver BDRV to data bus DBUS.According to this example, the data bus DBUS has 32 bits. The write bitline is connected to a write circuit 28. The write circuit 28 applies awrite voltage to the corresponding write bit line GBLw according to thelogic value of each of the bits of write control data of 1024 bits. Thewrite control data is given from a write data latch circuit 29. Writedata of 1024 bits given in 32 bits sequentially from the CPU 3 areinputted to the write data latch circuit 29 via a data selector (secondselector circuit) 30 to be preset. In verify read, data read out to thewrite bit line GBLw is selected in 32 bits by the data selector 30. Theselected data is amplified by a verify amp 31 to be outputted outside.The data externally read in the verify read is verify-decided by the CPU3 in bits. The decision result is loaded as new write control data fromthe CPU 3 via the write selector 30 to the data latch circuit 29. Theselection operation of the data selector 30 is not particularly limitedand is performed based on the address signal supplied from the addressbus ABUS.

A control circuit 32 performs control sequence and operation powersource switch control according to read, erase and write operationsaccording to memory control information set from the CPU 3 via controlbus CBUS and the data bus DBUS.

<Nonvolatile Memory Cell>

A specific example of the nonvolatile memory cell will be describedhere.

FIG. 3 illustrates a stacked gate structure as an example of thenonvolatile memory cell. The nonvolatile memory cell MC shown in thedrawing is formed with a channel area between a source area 40 connectedto source line (a second data line) SL, a drain area 41 connected to thesource line SL, and a drain area 42 connected to bit line (a first dataline) BL. Drain areas 41 and 42 can include an n+ region (“n+”). Thestacked gate structure can also include an n− region (“n−”), a p+ region(“p+”), a p− region (“p−”), and a p substrate (“p-Sub”). A floating gateelectrode 43 is formed via a gate insulating film over the channel area.A control gate electrode 44 is formed via an oxide film thereover. Thefloating gate electrode 43 is made by a polysilicon layer. The controlgate electrode 44 is made by a polysilicon wire and becomes part of wordline WL.

Operation voltages when write is performed by hot carrier injection areas follows. For example, write is performed by hot carrier injectionfrom the drain area 42 to the floating gate 43 when word line voltage Vgis 10V, bit line voltage Vd is 5V, source line voltage Vs is 0V, andwell voltage Vw is 0V. Erase is performed by drawing out an electronfrom the floating gate 43 to the well area when word line voltage Vg is−10V, well voltage Vw is 10V, and the bit line and the source line havehigh impedance. Read is performed when word line voltage Vg is a sourcevoltage, bit line voltage Vd is a source voltage, source line voltage Vsis 0V, and well voltage Vw is 0V. In erase and write processing, a highvoltage must be applied to the word line WL and the well area.

Operation voltages when write is performed by FN tunnel are as follows.For example, write is performed by injecting an electron from the drainthrough the FN tunnel to the floating gate 43 when word line voltage Vgis −10V, bit line voltage Vd is 10V, source line voltage Vs is 0V, andwell voltage Vw is 0V. Erase is performed by drawing out an electronfrom the floating gate 33 to the well area when word line voltage Vg is10V, well voltage Vw is −10V, source line voltage Vs is −10V, and thebit line has high impedance. In erase and write processing, a highvoltage must be applied to the word line WL, the bit line BL and thewell area. Read is the same as above.

<Hierarchal Bit Line Structure>

FIG. 4 illustrates a detail of a hierarchal bit line structure of thememory mat. In the example of FIG. 4, one write bit line GBLw can beconnected to two bit lines BL via disconnect switch DSW in each ofmemory arrays. FIG. 4 shows a layout of the disconnect switches DSW as adisconnect switch array 34 between memory arrays 21 adjacent to eachother. In the horizontal direction in FIG. 4, 2048 bit lines, 1024 writebit lines GBLw and 32 read main bit lines GBLr are arranged. 32 senseamps SA are arranged in such a manner that one sense amp SA is arrangedfor 64 bit lines BL. UT means an area in which 64 bit lines arearranged. A column selector circuit 22 selects one in 64 bit lines from2048 bit lines to connect it to the corresponding sense amp SA. All thedisconnect switches DSW are turned off in read and erase operations. Inwrite and verify read operations, 1024 disconnect switches DSW in onerow on the side of the memory array to be written are turned on.

For example, in a data read operation, one word line WL is selected andthe storage information of the selected memory cell appears on the bitline BL. One of 64 bit lines BL is selected to be transmitted to theinput of the corresponding sense amp SA. The sense amp SA drives thecorresponding read main bit line GBLr. The hierarchal bit line structureof divided memory arrays can reduce the input load capacity of the senseamp SA. Since 1024 write bit lines GBLw corresponding to the number ofparallel write bits to the memory arrays are provided, parallel writecan be made by a predetermined number of bits without being limited tothe number of read bits (e.g., 32 bits) of the storage information fromthe memory array.

The bit line BL can be connected and disconnected to/from the write bitline GBLw via the disconnect switch DSW. The disconnect switch DSW ofthe memory array to be read in a read operation is disconnected from thewrite bit line. Accordingly, an undesired load of the write bit lineGBLw can be disconnected in the read operation, ensuring fast read. Inaddition, the memory array to be read is disconnected from the write bitline GBLw. The read operation of the read main bit line and the writeoperation of the write bit line GBLw can be performed in parallel inmemory arrays different from each other.

The verify read performs transmission to the verify amp 31 using thewrite bit line GBLw. The verify amp need not be distributed for each ofthe memory arrays.

<Differential Sense>

FIG. 5 illustrates a detail of a hierarchal bit line structure of thememory mat performing differential sense. In the example of FIG. 5, thesense amplifiers (“sense amps”) SA(L) and SA(R) have a differentialamplification form performing differential input to a pair of memoryarrays adjacent to each other on the upper and lower sides of thedrawing. Sense amplifiers SA(L) and SA(R) also receive an input signalCBL and operate in accordance with control signals SPC(L), SPC(R),SEN(L) and SEN(R). One of a pair of differential inputs is a read signalfrom the bit line BL selected by one of the memory arrays and the otherinput is a reference input. The differential sense contributes to afaster read operation. The read main bit line GBLr is provided with amain amp MA so that the read operation is much faster. A differentialamp is used as the main amp MA. One of a pair of main bit lines GBLr(L), GBLr (R) is a read signal input and the other is a reference input.The main amp MA is differentiated so that the read operation is muchfaster. The differential main amp MA is employed so that FIG. 5 isdifferent from FIG. 4 in that the sense amp SA is provided for 32 bitlines BL as a unit and 64 sense amps are totally provided. Both aresimilar in that the write processing unit to the nonvolatile memory is1024 bits and the external input and output unit is 32 bits.

The main amp MA has transfer gate TRG switch-controlled by equalizesignal MEQ and making the corresponding pair of read main bit lines GBLr(L), GBLr (R) conductive, static latch LAT connected to thecorresponding pair of read main bit lines GBLr (L), GBLr (R) andactively and inactively controlled by amp enable signal MEN, and outputinverter INV whose input terminal is connected to the input/output nodeon one side of the static latch LAT and whose output terminal isconnected to the bus driver BDRV.

FIG. 6 shows an example of the sense amp SA (L) for differential sense.In the drawing, p channel type MOS transistors whose gate electrodes areindicated by small circles are discriminated from n channel type MOStransistors. It has differential input MOS transistors Q5, Q6 connectedrespectively to output signal line CBL (T) of one of memory arrays andto output signal line CBL (B) of the other memory array. These areconnected to a latch circuit in a static latch form by MOS transistorsQ1 to Q4. The MOS transistors Q1, Q4 are provided respectively withinitializing MOS transistors Q7, Q8 in parallel to be connected to thesource voltage. The common source of the MOS transistors Q5, Q6 isconnected via a power switch MOS transistor Q11 to the ground voltageVss of the circuit. The gates of transistors Q7 and Q11 are connected tosense amplifier control signal SEN(L). Sense amplifier control signalSEN(R) is connected to corresponding transistor gates in sense amplifierSA(R) (not shown in FIG. 6). One of a pair of storage nodes of the latchcircuit of the MOS transistors Q1 to Q4 is connected to the gate of aMOS transistor Q9 of the output inverter. The other is inverted andconnected to the gate of a MOS transistor Q10 of the output inverter.The common drain of the MOS transistors Q9, Q10 constructing the outputinverter is connected to the corresponding read main bit line GBLr. Thenumeral Q12 denotes an equalize MOS transistor of the CBL (T) and CBL(B). The numerals Q13, Q14 denote precharge MOS transistors. The gatesof transistors Q12, Q13 and Q14 are connected to sense amplifier controlsignal SPC(L). Sense amplifier control signal SPC(R) is connected tocorresponding transistor gates in sense amplifier SA(R) (not shown inFIG. 6). The numeral Q15 denotes a comparison current MOS transistor.The numerals Q16, Q17 denote transfer MOS transistors controlled bysignals CCS(T) and CCS(B) selectively making the comparison current MOStransistor Q15 conductive to the signal lines CBL (T) and CBL (B). Thecomparison current MOS transistor Q15 flows an electric current of halfof an electric current flowing to the memory cell MC in the on state bya gate bias voltage CCB (Ion=Imen/2).

In the inactivating period in the sense amp SA (L), the transistors Q7,Q8 are turned on, the transistor Q11 is turned off, and the outputinverter having the transistors Q9, Q10 are brought into a highimpedance state. In this state, the transistors Q12, Q13 and Q14 areturned on to precharge both the signal lines CBL (T) and CBL (B) to ahigh level. When the sense amp SA (L) senses a read signal from thesignal line CBL (T) side, the transistors Q7, Q8 are turned off, thetransistor Q11 is turned on, the transistor Q17 is turned on, and thetransistor Q16 is turned off. A read signal voltage is applied to thetransistor Q5. A reference voltage is applied to the transistor Q6.According to both inputs, the output inverter having the transistors Q9,Q10 drives the read main bit line GBLr. In the read operation, the senseamp SA (R) on the opposite side is a reference side and is maintained inthe inactive state. At this time, since both the read main bit linesGBLr (L) and GBLr (R) have been equalized, the main amp MA defines thestate of the latch circuit LAT according to the high level driving orthe low level driving to the read main bit line GBLr (L) of the senseamp SA (L) to drive the bus driver BDRV.

FIG. 7 shows a timing chart of data read operations of the differentialsense amp and the differential main amp. In the upper memory array 21 inFIG. 5, the storage information of the memory cell in the positionrepresented by a circle is read on the SA (L) and the SA (R) is areference side.

When an address signal is changed at time t0, the selection state of thecolumn decoder is changed in synchronization with it to start selectionof the word line. During this, SPC (L) is brought to the low level toperform the precharge and equalize operations of the sense amp SA (L).The precharge and equalize operations of the sense amp SA (R) on thereference side remain disabled. The comparison current selectionswitches Q16, Q17 are brought into the off state at the precharge andequalize operations of the sense amp SA (L). The signal lines CBL (B)and CBL (T) are charged from the low level to the high level. When theprecharge and equalize operations of the sense amp SA (L) areterminated, the comparison current selection switch Q17 on the non-senseside is turned on. On the signal line CBL (T) side, the level is changedaccording to the threshold voltage of the memory cell. On the signalline CBL (B) side, the level is changed according to the referencecurrent flowed to the Q15. Until the level change is increased to somedegree, the sense amp SA (L) is inactive. During this, the main amp MAis equalized and the read main bit lines GBLr (R), GBLr (L) are broughtto the intermediate level. When the sense amp SA (L) is activated attime t2, a difference voltage of the signal lines CBL (T) and CBL(B) isdifferentiated and amplified to amplify the read main bit lines GBLr(R), GBLr (L). The main amp MA is started up at time t3 to furtheramplify the read main bit lines GBLr (R), GBLr (L), thereby deciding theoutput OUT. In FIG. 7, signals SPC(L) <READ>, SPC(R) <REFERENCE>, SEN(L)<READ>, and SEN(R) <REFERENCE>are control signals to a sense amp,signals CCS <COMPARISON CURRENT SELECTION>, CCS(T), CBL(B) <PREFERENCE>,and CBL(T) <READ> are input signals to a sense amp, and signals GBLr(R)<REFERENCE> and GBLr(L) <READ> are output signals of a sense amp.

FIG. 8 shows another detail of the hierarchal bit line structure of thememory mat performing differential sense and having the differentialamps SA(L) and SA(R). In a structure in which the sense amp and columnselector circuit are connected between the memory arrays, it is assumedthat a high voltage is applied to the bit line BL at write or erase. Inthe operation speed of the sense amp and the column selector circuit, itis desirable that the transistor constructing the circuits is not ahigh-voltage MOS transistor. In this case, as shown in FIG. 8, adisconnect circuit 50 connected and disconnected by the high-voltage MOStransistor may be provided between the memory array and the columnselector circuit. Not only in the case of constructing the sense amp andthe column selector circuit by the high-voltage MOS transistor, but alsoin a circuit structure in which a high voltage of write and erase is notapplied to the bit line as in the split gate structure, the disconnectcircuit 50 is unnecessary. Sense amplifiers SA(L) and SA(R) operate inaccordance with control signals SPC(L), SPC(R), SEN(L) and SEN(R).

<Sense Amp Power Source Wiring Layout>

FIG. 9 illustrates a power source wiring layout of the sense amp arrays.By the hierarchal memory arrays 21 described in FIGS. 2 and 5, the senseamp arrays 23 are distributed in the parallel direction of the memoryarrays 21. Narrow individual power source wires (first power sourcewires) (vdd) 61, (vss) 62 are provided along the sense amp SA arraydirection for every plural sense amp arrays 23. Shared power sourcewires (second power source wires) vdd (WIDE)63, vss (WIDE)64 wider thanthe individual power source wires 61, 62 are provided in positionsspaced from the individual power source wires 61, 62. The respectiveindividual power source wires 61, 62 are connected to the shared powersource wires 63, 64 in a plurality of positions by connection powersource wires (third power source wires) (vdd) 65, (vss) 66 provided inthe bit line BL direction. In particular, in this example, one write bitline GBLw is provided for two bit lines in each of the memory arrays,and the disconnect switch DSW selects to which bit line is connected.One write bit line GBLw does not correspond to one bit line BL in eachof the memory arrays. In other words, when the number of parallel writebits is decided to be 1024, there is employed a layout in which thenumber of memory cells arrayed in the word line direction is doubled andthe number of word lines can be reduced by that in order to obtain anecessary storage capacity. Focusing on this, each of the connectionpower source wires 65, 66 is arranged between every two bit lines BL tominimize the increased chip occupation area of the connection powersource wires 65, 66.

The power source wires 61, 63 and 65 are intended for the source voltageVdd. The power source wires 62, 64 and 66 are intended for the groundvoltage Vss of the circuit. The individual power source wires 61, 62 andthe connection power source wires 65, 66 are power source wires of 0.24μm. The shared power source wires 63, 64 are wide power source wires of10 μm.

In the power source wiring layout, the operation voltages are notsupplied to the respective sense amp arrays 23 from one end side in thearray direction. The operation voltages Vdd, Vss are supplied thereto inparallel from a large number of connection power source wires 65, 66crossing in the array direction. When a large number of sense amps SAare operated in parallel, potential change due to current concentrationis difficult to occur. This is easily understood by focusing on thenumber of connection power source wires 65, 66. Each of the numbers ofconnection power source wires 65, 66 is the number of half of the numberof the write bit lines GBLw, and is 512 according to the example of thenumber of parallel write bits of 1024. The width of each of theconnection power source wires 65, 66 is 512×0.24 μm=122.88 μm.

A large number of wide individual power source wires of 10 μm for sourcevoltage and ground voltage need not be arrayed in each of the sense amparrays 23 to be spaced. It is possible to prevent the increased chipoccupation area due to the power source wires of the sense amps inproportion to the number of sense amp arrays 23.

FIG. 10 shows a comparison example of the sense amp power source layout.The individual power source wires 61, 62 for each of the sense amparrays 23 are connected to power source branch lines, not shown, at bothends. A power source is supplied from both ends of the power sourcewires 61, 62. When a plurality of sense amps SA are operated inparallel, current concentration occurs. The wire width of the individualpower source wires 61, 62 must be increased to some degree to suppressnoise. In the example of FIG. 10, the width of the individual powersource wires 61 (for the source voltage Vdd) and 62 (for the groundvoltage Vss of the circuit) of each of the sense amp arrays 23 isincreased. For example, the wire width of each of the individual powersource wires 61, 62 are 10 μmm. For example, a layout width of 50 μm ofthe column selector circuit 22 and the sense amp array 23 is required.When this is performed for each of the sense amp arrays 23, the chipoccupation area of the nonvolatile memory is increased. When eightblocks of the selector circuits 22 and the sense amp arrays 23 arearranged in the memory mat 20, the width of the individual power sourcewires 61, 62 of the sense amp arrays needs 160 μm. In the example ofFIG. 9, the wire width of the shared power source wires 63, 64 is about20 μm. In the example of FIG. 10, one write bit line GBLw is arrangedfor one bit line BL in each of the memory arrays.

<Parallel Access>

The flash memory 9 explained in FIGS. 2 and 4 separately has the readmain bit line GBLr for read and the write bit line GBLw for write. Thedisconnect switch DSW of the memory array 21 to be read in a readoperation disconnects the write bit line GBLw from the bit line BL. Aread operation and erase and write operations can be performed inparallel to the different memory arrays 21. In order to perform theerase and write operations in the same cycle, as illustrated in FIG. 11,the flash memory separately has a row decoder for read 70 selecting theoperation of the word line WL (READ WL SELECTION), the disconnect switchDSW and the sense amp SA in a read operation (READ SENSE AMP SELECTION),and a row decoder for write (a second address decoder) 71 selecting theoperation of the word line WL (WRITE WL SELECTION) and the disconnectswitch DSW (WRITE HIERARCHY SELECTION) in a write operation. Addresslatches 72, 73 are arranged at the previous stages of the decoders 70,71, respectively. The row decoder for read 70 and the column decoderCDEC means a first address decoder.

FIG. 12 illustrates operation timings of write processing and readprocessing to memory arrays different from each other. In FIG. 12,signal WL(WRITE) is the word line in a write operation, signalGBLw(WRITE) is the write bit line (reference FIG. 2), signal WL(READ) isthe word line in a read operation, and signal GBLw(READ) is the readmain bit line. FIG. 13 illustrates an application example of the flashmemory of FIG. 11. The memory arrays of part of the memory mat 20 are astorage area (rewrite sequence area) 74 storing a rewrite sequenceprogram of the flash memory and the remaining memory arrays are astorage area (user memory area) 75 which can be freely rewritten by theuser. As explained based on FIG. 11, the hierarchal bit line structurerealizing the hierarchal sense method is disconnected from the write bitline structure to perform write and read in parallel in the same memorycycle. While reading and executing the rewrite sequence program, thememory of the user area can be rewritten. As illustrated in FIG. 14, acommand for rewrite control is fetched directly from the rewritesequence area 74 to perform rewrite to the user memory area 75 based onit (S1 of FIG. 15). FIG. 15 illustrates a rewrite control procedure. TheCPU 3 fetches the command for rewrite control directly from the rewritesequence area 74 to set control data to a rewrite control register ofthe control circuit 32 based on it (S2). For write, the CPU 3 transferswrite data to the flash memory 9 (S3). The flash memory 9 selects apredetermined area of the user memory area 75 by an address signal. Forwrite, a write voltage is applied, and for erase, an erase voltage isapplied (S4).

The rewrite sequence program need not be transferred to the RAM 4 tofetch the command from the RAM 4 for controlling rewrite. This can savetransfer time of the rewrite sequence program having a relatively largeprogram capacity and can mount the flash memory 9 over a semiconductorintegrated circuit not incorporating the RAM to perform rewrite by CPUcontrol.

<Pipeline Access>

The flash memory 9 explained in FIGS. 2, 4 and 5 can perform a readoperation in parallel for each memory array in the memory array to thesense amp by the hierarchal bit line structure having the sense amparray 23 interposed therein. Focusing on this, in the pipeline access,the first and second address decoders employ address code logicperforming address mapping so that the memory arrays sharing the senseamp are different to consecutive addresses. When sequentially accessingthe adjacent data in access units, the different memory arrays aresuccessively selected. In FIG. 16, when the memory mat is grasped ashierarchies A to D, the physical addresses of the memory cell arerepeatedly arranged in the order of hierarchies A, B, C and D. In FIG.16, for each of the hierarchies A, B, C and D, suffixes a, b, c or d isgiven to the word lines WL, the precharge signals SPC (L) and SPC(R),and the sense amp enable signals SEN (L) and SEN(R), which arerepresentatively shown. The decoder shown in FIG. 16 is a generic termfor the row decoder RDEC and the column decoder CDEC.

FIGS. 16 to 18 are diagrams of assistance in explaining a first pipelineaccess form assuming the address mapping. FIG. 16 is a schematic blockdiagram of the flash memory when realizing the first pipeline accessform. In FIG. 16, SA(L) and SA(R) refer to sense amps. FIG. 17 is alogic circuit diagram of the decoder. FIG. 18 is a timing chart of apipeline read operation. In FIGS. 16–18, WLa, WLb, WLc, and WLd are wordlines; SPCa, SPCb, SPCc, SPCd, SENa, SENb, SENc, and SENd are sense ampcontrol lines.

In the first pipeline access form, in a read operation, the row decoder(RDEC) 25 explained in FIG. 2 responds to the change of an addresssignal to hold an address decode signal for each of the correspondingmemory arrays by the number of cycles necessary for the read operation,and responds to the change of the address signal to operate the senseamp with delay. The column decoder (CDEC) 26 is the same as a normalread operation and selects the bit line by the memory mat on theselected word line side based on the decode result of the row decoder.At least, the selection period is overlapped with the sense amp drivingperiod.

As illustrated in FIG. 18, in the case of two read cycles 2-CYCLE ACCESSREQUIRED of a clock signal 1-CYCLE, while changing an address signal foreach cycle, data A, B, C and D of consecutive addresses A, B, C and Dcan be sequentially read OUTPUT FOR EACH CYCLE.

The logic of the row decoder RDEC for performing such pipeline access isas illustrated in FIG. 17. The row decoder RDECa (meaning the rowdecoder RDEC of the hierarchy A) whose detail is shown decides a readaccessed hierarchy by a high-order pre-decoder unit 80 and decides theaccessed word line in the hierarchy by the low-order pre-decoder unit sothat an AND signal to both outputs is a select signal of the word lineWLa. Both of the pre-decoder units 80, 81 basically have the sameconstruction. As in the high-order pre-decoder unit 80 whose detail isrepresentatively shown, the decode result of a pre-decoder 82 decoding ahigh-order address is held by latch circuits 83, 84 in two cycles ofclock signal CLK for output. The pre-decoder of the low-orderpre-decoder unit 81 decodes a low-order address. The precharge signalSCPa and the sense amp activating signal SENa are generated by timingadjusting the decode result signal of the pre-decoder 82 of thehigh-order pre-decoder 80 using three delay circuits (DELAY 1˜3) 85.Other row decoders RDECb, RDECc and RDECd are similarly constructed.Signal generation circuit MDG generating the activating control signalMEN of the main amp MA has two latch circuits 87, 88 in series latchingmodule select signal MSEL selecting the read operation of the flashmemory in synchronization with the clock signal CLK, and a pulsegeneration circuit 89 generating a pulse based on the output change ofthe last latch circuit 88.

FIGS. 19 to 21 are diagrams of assistance in explaining a secondpipeline access form assuming the address mapping. FIG. 19 is aschematic block diagram of a flash memory when realizing the secondpipeline access form. FIG. 20 is a logic circuit diagram of the decoder.In FIG. 20, RDECab is a decoder. FIG. 21 is a timing chart of a pipelineread operation. In the flash memory realizing the second pipeline accessform, the sense amp SA must employ the structure of FIG. 22 in place ofFIG. 6.

In FIG. 19, for each of the hierarchies A, B, C and D, suffixes a, b, cor d is given to the word line WL, the precharge signal SPC, the senseamp enable signal SEN and the read main bit line drive signal GBLrDRV,which are representatively shown; that is, GBLrDRVa, GBLrDRVb, GBLrDRVc,and GBLrDRVd are read main bit line drive signals; WLa, WLb, WLc, andWLd are word lines; and SPCa, SPCb, SPCc, SPCd, SENa, SENb, SENc, andSENd are sense amp control lines for the respective hierarchies A, B, Cand D. The decoder shown in FIG. 19 is a generic term for the rowdecoder RDEC and the column decoder CDEC. SA(L) and SA(R) refer to senseamps.

In the second pipeline access form, in a read operation, the row decoder(RDEC) 25 explained in FIG. 2 selects, in parallel, both word lines ofan address specified by an address signal and the next address, andsequentially drive controls the driving of the second bit line of therespective sense amps corresponding to the specified address and thenext address. The column decoder (CDEC) 26 selects the bit line in thememory mat on the selected word line side based on the decode result ofthe row decoder 25. At least, the selection period is overlapped withthe sense amp drive period. The word lines of the sequential addressesare selected in parallel. In response to this, the bit lines are alsoselected in parallel in the respective memory arrays.

As illustrated in FIG. 21, in the case of two read cycles 2-cycle accessrequired of the clock signal 1-cycle, when the address A is specified inthe first memory cycle and the address C is specified in the next memorycycle, word line selection, bit line selection and sense amp driving areperformed in the memory mat of the address A in the first memory cycle(CLK 2 cycles). In parallel with it, word line selection, bit lineselection and sense amp driving are performed in the memory mat of theaddress B. In the next memory cycle (CLK 2 cycles), word line selection,bit line selection and sense amp driving are performed in the memory matof the address C. In parallel with it, word line selection, bit lineselection and sense amp driving are performed in the memory mat of theaddress D. The outputs of the sense amps SA of the four memory arraysare performed in series in the order of the data A, B, C and D.

The structure of the sense amp SA for performing such pipeline access isas illustrated in FIG. 22. In order to separately control the timings ofthe sense and output operations, in the structure of FIG. 6, the outputoperation of the MOS transistors Q9, Q10 is enabled after the read mainbit line drive signal GBLrDRV is activated, and OR gates 90, 91 and aninverter 92 are added. In FIG. 22, SA(L) is a sense amp; SPC(L) andSEN(L) are control signals of a sense amp; and CCS(T), CBL(T), CBL(B),CCB, and CCS(B) are input signals of a sense amp.

The logic of the row decoder RDEC for performing the second pipelineaccess form is as illustrated in FIG. 20. The row decoder RDECab meaningthe row decoder RDEC of the hierarchies A and B is illustrated here. Thehigh-order pre-decoder unit 80 and the low-order pre-decoder unit 81have the same construction as the RDECa and RDECb of FIG. 17. The ANDsignals of both are select signals of the word lines WLa, WLb. Theprecharge signals SPCa, SPCb are generated by a pulse generation circuit(including a delay 1) 100 generating a pulse based on the output changeof the high-order pre-decoder 82. The sense amp activating signals SENa,SENb are generated by a delay latch circuit 101 inputting the output ofthe latch circuit 84 and the output of the pulse generation circuit 100.The read main bit line drive signals GBLrDRVa, GBLrDRVb are sequentiallyactivated by successively delaying the output of the latch circuit 84 bydelay circuits (DELAY 3 AND 4) 102, 103, 104 and 105.

<Memory Card>

FIG. 23 and FIG. 24 shows a schematic diagram of a memory card as anexample of the nonvolatile memory device according to the presentinvention. A memory card 120 has an interface part 121 performinginterface with outside, a controller (CONTROLLER PART) 122 having thebuffer memory (BUFFER MEMORY) performing operation control of the memorycard, and one or more nonvolatile memories 123 of the present invention.The controller 122 couples to the interface part 121 by the data bus(DATA) and the address bus (ADDRESS), and couples to the nonvolatilememory 123 by the data bus (DATA) and the address bus (ADDRESS). As inthe flash memory 9 represented by FIG. 5, the nonvolatile memory 123 canperform a read operation in parallel with the write operation in othermemory arrays except for a memory array including a memory cellperforming write and a memory array in which the sub bit line of thememory array is a reference input of the sense amp. To write and readoperation requests from outside, the controller can perform operationsto these requests in parallel. As in FIG. 24, in the case of the memorycard 120 having an address translation table (ADDRESS TRANSLATION TABLE)124 of an address logical address (LOGICAL ADDRESS) inputted fromoutside and an address (physical address) accessed in the nonvolatilememory, when performing a write operation, new data may be written intoan arbitrary physical address (PHYSICAL ADDRESS) to update the addresstranslation table. The memory card 120 having such address translationtable 124 can select a physical address so as to provide a memory arraycapable of performing a write operation in parallel with the memoryarray including the physical address performing a read operation,perform the read and write operations in parallel, and update theaddress translation table, thereby shortening turnaround time of thewrite and read operations in appearance.

<Verify Access>

There will be described an embodiment which focuses on verify read whenthe write and read operations are performed in parallel by differenthierarchies of the memory arrays.

FIGS. 25 to 29 illustrate a first embodiment which can prevent conflictof read data of verify read and read data of a read operation when thewrite and read operations are performed in parallel in differenthierarchies.

FIG. 25 schematically shows the flash memory when realizing the readdata conflict prevention. The drawing illustrates memory arrays for twohierarchies A, B. The verify main bit lines GBLv are providedcorresponding to the read main bit lines GBLr. MAr for read and MAv forverify as the main amps are provided to right and left areas UT. Theiroutputs are selected by selector SEL. The inputs of the main amp MAr forread are connected to the read main bit lines GBLr of the correspondingright and left areas UT in which one of them is on the sense side andthe other is on the reference side. The inputs of the main amp MAv forverify are connected to the main bit lines GBLv for verify of thecorresponding right and left areas UT in which one of them is on thesense side and the other is on the reference side. The verify read datais transmitted via the data bus to the CPU, not shown, for comparison.Other constructions are the same as the constructions explained in FIGS.4 and 5. In FIG. 25, SA(L) is a sense amp and GBLv [VERIFY GBL] and GBLr[READ GBL] are output signals of a sense amp.

FIG. 26 shows an operation timing chart of FIG. 25. There will bedescribed an operation in which in FIG. 25, the hierarchy A performs aread operation and the hierarchy B performs a verify read operation asthe first step of a write operation.

The timing chart of FIG. 26 shows an example in which timing in whichthe read GBL drive signal GBLrDRVa is enabled in the hierarchy A and thesense amp SA (L) of the hierarchy outputs read data to the read main bitline GBLr is the same as timing (1-CYCLE ACCESS) of a clock signal(1-CYCLE) in which the verify GBL drive signal GBLrDRVb is enabled inthe hierarchy B and the sense amp SA (L) of the hierarchy outputs readdata to the verify main bit line GBLv for outputting data. In this case,the selector SEL connected to select signal ASL outputs a signalamplified by the main amp MAr of the hierarchy A connected to the readmain bit line GBLr side to the data bus. After that, the selector SELoutputs a signal amplified by the main amp MAv on the hierarchy B sideconnected to the verify main bit line GBLv to the data bus. This allowsthe read operation to have priority over the verify operation, which maybe reversed. When any one of the MAr and MAv performs a signal outputoperation, the other main amp may start an output operation aftercompletion of the output.

FIG. 27 schematically shows another flash memory when realizing the readdata conflict prevention. It is different from FIG. 25 in that the mainamp MA is arranged for the read main bit line GBLr and verify comparatorCMP is arranged for the verify main bit line GBLv. The verify comparatorCMP compares the write data supplied from the data bus with the dataread from the verify main bit line GBLv to decide whether the writeoperation is completed or not. In FIG. 27, SA(L) is a sense amp and GBLv[VERIFY GBL] and GBLr [READ GBL] are output signals of a sense amp.

FIG. 28 shows an operation timing chart of FIG. 27. FIG. 28 shows anexample in which in FIG. 27, the hierarchy A performs a read operationand the hierarchy B performs a verify read operation as the first stepof a write operation. The timing chart of FIG. 28 shows an example inwhich timing in which the read GBL drive signal GBLrDRVa is enabled inthe hierarchy A and the sense amp SA (L) of the hierarchy outputs readdata to the read main bit line GBLr is the same as timing (1-CYCLEACCES) of a clock signal (1-CYCLE) in which the verify GBL drive signalGBLvDRVb is enabled in the hierarchy B and the sense amp SA (L) of thehierarchy outputs read data to the verify main bit line GBLv. In thiscase, a signal amplified by the main amp MA connected to the read mainbit line GBLr is outputted to the data bus. In parallel with this, theverify comparator CMP connected to the verify main bit line GBLvcompares the write data with the data read from the verify main bit lineGLBv. In the write data circuit, not shown, including the verifycomparator CMP, the write operation is continued when the comparisonresult indicates that the write operation is not completed. The write isterminated to the memory cell to be written connected to the verify mainbit line GBLv when the comparison result indicates that the writeoperation is completed. In FIG. 27, the write data is inputted directlyfrom the data bus to the input of the verify comparator CMP which has anoutput signal CMP (VERIFY COMPARATOR). Actually, it should be understoodthat the write data is inputted via the write data latch and other writecircuits, not shown.

The flash memory can perform the write and read operations in differenthierarchies in parallel and can shorten turnaround time of the write andread operations in appearance.

FIG. 29 illustrates a detail of the sense amp SA used in the embodimentshown in FIGS. 25 to 28. The sense amp shown in the drawing has aselector circuit part deciding, by the read GBL drive signal GBLrDRV andthe verify GBL drive signal GBLvDRV, to which of an output driverconnected to the read main bit line GBLr and having the transistors Q9,Q10 and an output driver connected to the verify main bit line GBLv andhaving the transistors Q20, Q21 an output signal is supplied. Theselector part has gate circuits 90 to 95. The structure of FIG. 29 isdifferent from of that of FIG. 22 in that the output driver having thetransistors Q20, Q21 and the selection logic having the gate circuits 90to 95 are added. The sense amp SA is thus constructed to amplify andoutput a signal read from the memory cell to any one of the read mainbit line GBLr and the verify main bit line GBLv in one amp circuit. InFIG. 29, signals CBL(T), CBL(B), CCB, CCS(B), CCS(T), and CCS(B) areinput signals of a sense amp; signal SPC(L) is a control signal of asense amp; and GBLr [READ GBL] and GBLv [VERIFY GBL] are output signalsof a sense amp.

The above-described embodiments of the present invention can obtain thefollowing operation effects.

(1) The bit line direction is divided into some parts. The columndecoder and the read circuit such as the sense amp are arranged for thedivided sub-bit lines. This can reduce the bit line load capacity.

(2) The column decoder and the sense amp are inserted between the upperand lower symmetrical sub-bit lines to operate the upper and lowercolumn decoders in parallel. When reading the upper sub-bit line, thelower sub-bit line is a reference line. When reading the lower sub-bitline, the upper sub-bit line is a reference line. The potentials of thetwo sub-bit lines are compared by the differential sense amp. Thedifferential sense of the bit line potentials contributes to a fasterread operation.

(3) The output of each of the sense amp circuits can be drawn out to thememory array end via the read main bit line to be connected to the businterface circuit.

(4) The structure connecting the read main bit line to the main amp isemployed so that the read operation is much faster.

(5) Aside from the read main bit line, the write bit line is arranged tobe connected to the divided sub-bit lines via the hierarchal switch(disconnect switch). This ensures parallel write of a set of writecircuits.

(6) The verify read deciding completion of write/erase can be performedat a relatively low speed. The verify read uses the main bit line of thewrite. No circuits used for verify need be distributed.

(7) In the hierarchal sense method, a plurality of read circuits such asthe sense amps are arranged in the memory mat. The sense amp is arrangedto cross the bit line and the power source line also crosses the bitline. Since the plurality of sense amps operated cause currentconcentration, the power source width is large to suppress noise. Theplurality of large power source widths increase the module area. Whenconnecting the sub-bit line via the hierarchal switch to the write bitline, two bits or a plurality of sub-bit lines are connected to onewrite bit line. As a result, the metal pitch of the main bit lines isincreased and the power source wire can be passed between the main bitlines. Operation power sources are supplied from the power source wirein parallel with the bit line to the read circuit such as the sense ampto prevent the module area from being increased. At the same time,increase in the metal layer can be suppressed. When a plurality of senseamps SA are operated in parallel, no current concentration occurs tosuppress noise.

(8) The write main bit line different from the read main bit line isprovided to perform read and write/erase in the same cycle to thememories in different sub-bit lines. The memories in the same sub-bitline must not be accessed in the same cycle to prevent read data andwrite data from being conflicted. To execute read and write/erase in thesame cycle, two sets of the address latch circuit and the word linedecoder circuit may be prepared for read and write/erase.

(9) The memory storing the rewrite sequence program of the flash memoryand the memory rewritten by the user can be arranged in the same array.Both are divided using the read hierarchy sense and the write bit linestructure. While reading and executing the rewrite sequence program, thememory of the user area can be rewritten. Unlike the prior art, therewrite sequence program need not be transferred to the RAM and suchflash memory can be mounted over the semiconductor integrated circuitnot incorporating the RAM.

(10) The nonvolatile memory applying the present invention is used forthe memory card to perform the read and write operations in parallel.Turnaround time seen from the user can be shortened.

(11) When performing the read operation and the verify read operationduring the write operation in parallel in different hierarchies, thepaths of the read data from both are individualized to solve the readdata conflict from both. Turnaround time seen from the user can beshortened.

The present invention which has been made by the present inventors isspecifically described above based on the embodiments. The presentinvention is not limited to them and various modifications can be madein the scope without departing from its purpose.

For example, the nonvolatile memory cell may perform information storageby the differences in the threshold voltage or perform informationstorage by the differences in the position of carrier injection of anelectron. The information storage of one memory cell is not limited toone bit and may have a plurality of bits. The nonvolatile memory mayhave a plurality of memory mats to employ the hierarchal bit linestructure of the memory arrays to each of them.

When applying the present invention to a semiconductor integratedcircuit for data processing such as a microcomputer, the nonvolatilememory and the on-chip circuit module are not limited to the aboveexamples and can be suitably modified. The present invention can beapplied to a semiconductor integrated circuit having a singlenonvolatile memory. The nonvolatile memory is not limited to the flashmemory and may be a high-dielectric memory.

In the verify read explained with reference to FIG. 25 and later,instead of adding the verify main bit line, the write main bit line usedfor write can be used as a verify read main bit line.

The effects obtained by the representative inventions disclosed in thepresent invention will be briefly described as follows.

The load capacity connected to one sense amp can be reduced tosignificantly shorten read time. During read, write/erase can beperformed to another memory.

The power source wire is passed between the bit lines. It is connectedto a large number of sense amps. When the sense amps are operated inparallel, current concentration is difficult to occur. No wide powersource wires need be distributed and arranged for each of the sense amparrays, contributing to the smaller chip area.

The read main bit line is separated from the write main bit line tohandle read data and write data in parallel. The data processing systemusing the semiconductor integrated circuit of the present invention cancontinue a service with data read without stopping the system duringwrite/erase requiring relatively long time. When arranging the rewriteprogram in the same memory array, no exclusive memories storing therewrite sequence are needed.

1. A semiconductor integrated circuit comprising a nonvolatile memoryenabling electric erase and write over a semiconductor substrate,wherein said nonvolatile memory comprises a plurality of blocks each ofwhich has a plurality of first bit lines, a plurality of second bitlines, a plurality of third bit lines and a plurality of firstamplifiers, wherein each of said first bit lines is coupled with aninput terminal of a corresponding one of said first amplifiers, whereineach of said second bit lines is coupled with an output terminal of acorresponding one of said first amplifiers, and wherein each of saidthird bit lines is selectively coupled with a corresponding one of saidfirst bit lines and is used for transferring data to be written into amemory cell.
 2. The semiconductor integrated circuit according to claim1, wherein each of said first amplifiers is a differential amplifierhaving two input terminals and said output terminal, one input terminalis coupled to one of said first bit lines and the other input terminalis coupled to another of said first bit lines, and wherein each of saidfirst amplifiers is capable of using a signal inputted in one of saidtwo input terminals as a reference signal to sense data.
 3. Thesemiconductor integrated circuit according to claim 1, furthercomprising a plurality of second amplifiers, wherein an input terminalof each of said second amplifiers is coupled to corresponding one ofsaid second bit lines.
 4. The semiconductor integrated circuit accordingto claim 3, wherein each of said second amplifiers is a differentialamplifier having two input terminals and an output terminal, one inputterminal is coupled to one of said second bit lines and the other inputterminal is coupled to another of said second bit lines, and whereineach of said second amplifiers is capable of using a signal inputted inone of said two input terminals as a reference signal to sense data. 5.The semiconductor integrated circuit according to claim 2, furthercomprising a first switch circuit, wherein said first switch circuit isarranged between said first bit lines and said first amplifiers forselecting one of said first bit lines to be coupled with said one inputterminal of said first amplifier.
 6. The semiconductor integratedcircuit according to claim 5, further comprising a second switchcircuit, wherein said second switch circuit is arranged between saidfirst bit lines and said third bit lines for coupling said correspondingone of said first bit lines with one of said third bit lines.
 7. Thesemiconductor integrated circuit according to claim 6, furthercomprising a plurality of third amplifiers each of which is coupled witha corresponding one of said third bit lines and is capable of sensingverify read data from a coupled third bit line.
 8. The semiconductorintegrated circuit according to claim 1, wherein first power sourcewires are provided in parallel for every first amplifier, second powersource wires wider than the first power source wires are provided inpositions spaced from the first power source wires, and the first powersource wires are coupled to the second power source wires by third powersource wires laid in the first bit line direction.
 9. The semiconductorintegrated circuit according to claim 8, further comprising: a pluralityof third bit lines for write shared between said plurality of blocks insuch a manner that one of the plurality of third bit lines is providedfor every two first bit lines; and said second switch circuit beingcapable of selectively coupling one third bit line to any one of thecorresponding two first bit lines in each of said blocks.
 10. Thesemiconductor integrated circuit according to claim 9, wherein saidthird power source wires are arranged between every two adjacent firstbit lines.
 11. The semiconductor integrated circuit according to claim6, further comprising: a first address decoder being used in a readoperation for selecting one of a plurality of word lines, ones of saidfirst bit lines, said second switch circuit and ones of said firstamplifiers; and a second address decoder being used in a write operationfor selecting one of said word lines and said second switch circuit. 12.The semiconductor integrated circuit according to claim 11, wherein eachof said first address decoder and said second address decoder includesaddress code logic performing address mapping so that said blocks, eachof which couples to one of said first amplifiers via said first bitlines therein, are arranged with non-consecutive addresses.
 13. Thesemiconductor integrated circuit according to claim 12, wherein in aread operation, the first address decoder holds an address decode signaland a select signal of the first bit line for each of said blockscorresponding to a change of an address signal during a number of cyclesnecessary for the read operation, and responds to the change of theaddress signal to operate said first amplifiers with delay.
 14. Thesemiconductor integrated circuit according to claim 12, wherein in aread operation, the first address decoder selects, in parallel, wordlines and first bit lines according to an address and a next address,each of which is specified by address signals, drive controls thedriving of the second bit line of respective first amplifierscorresponding to said specified address and continuously drive controlscorresponding to said next address.
 15. The semiconductor integratedcircuit according to claim 12, further comprising a central processingunit capable of accessing said nonvolatile memory on said semiconductorsubstrate.
 16. The semiconductor integrated circuit according to claim15, wherein one or more of said plurality of blocks are used as a dataarea, a remaining number of said plurality of blocks are used as amanagement area, and said management area includes a storage area of arewrite sequence control program for rewriting the data area, whereinsaid central processing unit reads and executes the rewrite sequencecontrol program from said storage area and enables rewrite control ofthe data area.
 17. A semiconductor integrated circuit comprising: anonvolatile memory enabling electric erase and write; and a centralprocessing unit capable of accessing said nonvolatile memory on asemiconductor substrate, wherein said nonvolatile memory comprises ahierarchal bit line structure including first bit lines specific to eachof a plurality of memory arrays, a plurality of second bit lines sharedbetween the first bit lines of the plurality of memory arrays, and aplurality of sense amps arranged between said first bit lines and secondbit lines, and a number of said second bit lines is smaller than aparallel write bit number to the memory array.
 18. The semiconductorintegrated circuit according to claim 17, further comprising a third bitline for write shared between said plurality of memory arrays.
 19. Thesemiconductor integrated circuit according to claim 18, furthercomprising a disconnect circuit capable of connecting and disconnectinga corresponding first bit line for each of the memory arrays to/from thethird bit line, wherein the disconnect circuit effects saiddisconnecting in a read operation.
 20. A semiconductor integratedcircuit comprising a nonvolatile memory enabling electric erase andwrite on a semiconductor substrate, wherein said nonvolatile memorycomprises a hierarchal bit line structure including first bit linesspecific to each of a plurality of memory arrays, a second bit lineshared between the first bit lines, and a sense amp selectivelyamplifying data read from each said first bit line to output theamplified data to the second bit line.